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LMV797MM/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV797MM/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    YES
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    NO
  • Technology
    BICMOS
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • J-STD-609 Code
    e3
  • Packing Method
    TAPE AND REEL
  • Terminal Finish
    MATTE TIN
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    7940
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    2
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.635
  • Slew Rate-Min (V/us)
    6
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Supply Current-Max (mA)
    4.1
  • Package Equivalence Code
    TSSOP8,.19
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    6
  • Input Offset Voltage-Max (uV)
    1650
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    1.0E-6
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMV797MM/NOPB
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LMV797MM/NOPB