Texas Instruments Incorporated LMV226TL/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-XBGA-B4
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Telecom IC Type
    RF AND BASEBAND CIRCUIT
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Channels
    1
  • Number of Functions
    1
  • Number of Terminals
    4
  • Package Body Material
    UNSPECIFIED
  • Supply Current-Max (mA)
    8
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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LMV226TL/NOPB
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LMV226TL/NOPB