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LMP91300YZRR

Texas Instruments Incorporated

LMP91300YZRR Datasheet
Texas Instruments Incorporated LMP91300YZRR
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    2.3
  • Length (mm)
    2.5
  • JESD-30 Code
    R-XBGA-B20
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Channels
    1
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    UNSPECIFIED
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Seated Height-Max (mm)
    0.675
  • Supply Voltage-Max (V)
    40
  • Supply Voltage-Min (V)
    6.5
  • Supply Voltage-Nom (V)
    24
  • Package Equivalence Code
    BGA20,4X5,20
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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LMP91300YZRR