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LMH7324SQ/NOPB

Texas Instruments Incorporated

LMH7324SQ/NOPB Datasheet
Texas Instruments Incorporated LMH7324SQ/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    5
  • Length (mm)
    5
  • JESD-30 Code
    S-XQCC-N32
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e3
  • Packing Method
    TR
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Functions
    4
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    UNSPECIFIED
  • Response Time-Nom (ns)
    0.7
  • Seated Height-Max (mm)
    0.8
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    25
  • Package Equivalence Code
    LCC32,.2SQ,20
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    12
  • Input Offset Voltage-Max (uV)
    9500
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    5
  • Average Bias Current-Max (IIB) (uA)
    5
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Number of Elements
    4

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LMH7324SQ/NOPB
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LMH7324SQ/NOPB