Texas Instruments Incorporated LMC555CM
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    3.9
  • Length
    4.9
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    SOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    1.27
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Seated Height-Max
    1.753
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Output Frequency-Max
    3
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Analog IC - Other Type
    PULSE; RECTANGULAR
  • Package Equivalence Code
    SOP8,.25
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Current-Max (Isup)
    .4
  • Supply Voltage-Max (Vsup)
    15
  • Supply Voltage-Min (Vsup)
    1.5
  • Supply Voltage-Nom (Vsup)
    5
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    235
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for LMC555CM

Send an RFQ

Negotiated savings, bought with a click.

Send an RFQ
LMC555CM
Send an RFQ
LMC555CM