LM8333FLQ8X/NOPB by Texas Instruments Incorporated | Sourcengine

Texas Instruments Incorporated LM8333FLQ8X/NOPB

Lifecycle status
Active
RoHS
RoHS compliant
REACH
REACH compliant
Description
Mobile I/O Companion Supporting Key-Scan, I/O Expansion, PWM, and ACCESS.bus Host Interface 32-WQFN -40 to 85
Category
Semiconductors Interface ICs Other Interface ICs

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Technology
CMOS
Width (mm)
6
Length (mm)
6
JESD-30 Code
S-XQCC-N32
Package Code
HVQCCN
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
Surface Mount
YES
Terminal Form
NO LEAD
J-STD-609 Code
e3
Number of Ports
4
Terminal Finish
MATTE TIN
Address Bus Width
1
Bus Compatibility
I2C
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Number of I/O Lines
4
Number of Terminals
32
Terminal Pitch (mm)
0.5
Package Body Material
UNSPECIFIED
Seated Height-Max (mm)
0.8
Supply Voltage-Max (V)
2.9
Supply Voltage-Min (V)
2.25
Supply Voltage-Nom (V)
2.75
Supply Current-Max (mA)
80
Package Equivalence Code
LCC32,.23SQ,20
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30