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LM2512ASMX/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LM2512ASMX/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PBGA-B49
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LINE DRIVER
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    49
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    9
  • Package Equivalence Code
    BGA49,7X7,20
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30
  • Time@Peak Reflow Temperature-Max (s)
    40

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LM2512ASMX/NOPB
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LM2512ASMX/NOPB