Inphi Corporation. IN010C50-MD02-13GC-S03P
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    13
  • JESD-30 Code
    R-PBGA-B475
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Integrated Cache
    NO
  • Number of Timers
    3
  • Terminal Position
    BOTTOM
  • Number of Terminals
    475
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.06
  • Supply Voltage-Max (V)
    0.667
  • Supply Voltage-Min (V)
    0.634
  • Supply Voltage-Nom (V)
    0.65
  • Package Equivalence Code
    BGA475,19X19,20
  • Internal Bus Architecture
    MULTIPLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER

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IN010C50-MD02-13GC-S03P