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IDT7MBV4157S11

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. IDT7MBV4157S11
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-XXMA-X160
  • Memory Width
    64
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    UNSPECIFIED
  • J-STD-609 Code
    e0
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    UNSPECIFIED
  • Memory Organization
    128KX64
  • Number of Functions
    1
  • Number of Terminals
    160
  • Access Time-Max (ns)
    11
  • Number of Words Code
    128K
  • Memory Density (bits)
    8388608
  • Package Body Material
    UNSPECIFIED
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    131072
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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IDT7MBV4157S11