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IDT74SSTUBF32865ABKG8

Renesas Electronics Corp.

Renesas Electronics Corp. IDT74SSTUBF32865ABKG8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    SSTU
  • Width (mm)
    9
  • Length (mm)
    13
  • JESD-30 Code
    R-PBGA-B160
  • Package Code
    LFBGA
  • Trigger Type
    POSITIVE EDGE
  • Logic IC Type
    D FLIP-FLOP
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of Bits
    28
  • fmax-Min (MHz)
    410
  • Output Polarity
    TRUE
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    160
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    1.5
  • Seated Height-Max (mm)
    1.3
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA160,12X18,25
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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IDT74SSTUBF32865ABKG8