ProductsManufacturers
Events
Send an RFQBOM Tool

HYB25D128400CCL-6

QIMONDA AG

QIMONDA AG HYB25D128400CCL-6
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    4
  • Organization
    32MX4
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    134217728 bit
  • Memory IC Type
    DDR1 DRAM
  • Refresh Cycles
    4096
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.5 ns
  • Number of Words
    33554432 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    215 mA
  • Number of Terminals
    60
  • Standby Current-Max
    0.0045 Amp
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    2,4,8
  • Interleaved Burst Length
    2,4,8
  • Package Equivalence Code
    BGA60,8X12,40/32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Clock Frequency-Max (fCLK)
    166 MHz

0 suppliers available to buy or to bid for HYB25D128400CCL-6

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HYB25D128400CCL-6
Send an RFQ
HYB25D128400CCL-6