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HT24LC04(8DIP)

Holtek Semiconductor Inc.

Holtek Semiconductor Inc. HT24LC04(8DIP)
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    EEPROM CARD
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • I2C Control Byte
    1010DDMR
  • Write Protection
    HARDWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    512X8
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    512
  • Memory Density (bits)
    4096
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    40
  • Number of Words (words)
    512
  • Programming Voltage (V)
    2.7
  • Standby Current-Max (A)
    4.0E-6
  • Supply Current-Max (mA)
    5
  • Package Equivalence Code
    DIP8,.3
  • Endurance (Write/Erase Cycles)
    1000000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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HT24LC04(8DIP)