ProductsManufacturers
Events
Send an RFQBOM Tool

HN58W241000FPIE

Renesas Technology Corp.

Renesas Technology Corp. HN58W241000FPIE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    5.3
  • Length (mm)
    5.65
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e4
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • I2C Control Byte
    1010DDMR
  • Write Protection
    HARDWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.73
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.5
  • Supply Voltage-Nom (V)
    3
  • Data Retention Time-Min
    10
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    1.0E-6
  • Supply Current-Max (mA)
    4
  • Package Equivalence Code
    SOP8,.3
  • Clock Frequency-Max (MHz)
    1
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Write Cycle Time-Max (tWC) (ms)
    5
  • Time@Peak Reflow Temperature-Max (s)
    20

0 suppliers available to buy or to bid for HN58W241000FPIE

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HN58W241000FPIE
Send an RFQ
HN58W241000FPIE