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HCS361-I/SNVAO

Microchip Technology Inc.

Microchip Technology Inc. HCS361-I/SNVAO
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width (mm)
    3.9
  • Length (mm)
    4.9
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Telecom IC Type
    DATA ENCRYPTION CIRCUIT
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.75
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    1.6
  • Package Equivalence Code
    SOP8,.25
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    TS 16949
  • Time@Peak Reflow Temperature-Max (s)
    30

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HCS361-I/SNVAO
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HCS361-I/SNVAO