Compliance Details

  • SB Code
    8542.39.00.00
  • HTS Code
    8542.39.00.01
  • ECCN Governance
    EAR
  • ECCN
    EAR99
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Packaging type
Packaging condition
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Additional Information

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Technical Details

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  • Width
    2.5 mm
  • Length
    3.5 mm
  • JESD-30 Code
    R-XQCC-N16
  • Package Code
    HVQCCN
  • Sub Category
    Other Interface ICs
  • JESD-609 Code
    e4
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Power Supplies
    1.5/3.3 V
  • Terminal Pitch
    0.5 mm
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Interface IC Type
    INTERFACE CIRCUIT
  • Seated Height-Max
    0.8 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Voltage-Max
    3.6 V
  • Supply Voltage-Min
    1.1 V
  • Supply Voltage-Nom
    1.2 V
  • Number of Functions
    1
  • Number of Terminals
    16
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Package Equivalence Code
    LCC16,.1X.14,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
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