Compliance Details

  • SB Code
    8542.32.00.70
  • HTS Code
    8542.32.00.71
  • ECCN Governance
    EAR
  • ECCN
    EAR99
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Packaging type
Packaging condition
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Additional Information

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Technical Details

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  • Width
    4 mm
  • Length
    4.5 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-N8
  • Memory Width
    8
  • Organization
    8KX8
  • Package Code
    HVSON
  • Sub Category
    SRAMs
  • JESD-609 Code
    e3
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    65536 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Operating Mode
    SYNCHRONOUS
  • Power Supplies
    3.3 V
  • Terminal Pitch
    0.95 mm
  • Number of Words
    8192 words
  • Terminal Finish
    Tin (Sn)
  • Seated Height-Max
    0.85 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    0.003 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Standby Current-Max
    6.0E-6 Amp
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    SOLCC8,.16,37
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.65 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
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