Compliance Details

  • SB Code
    8542.33.00.00
  • HTS Code
    8542.33.00.01
  • ECCN Governance
    EAR
  • ECCN
    EAR99
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Packaging type
Packaging condition
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Additional Information

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Technical Details

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  • Power
    NO
  • Width
    1.25 mm
  • Length
    2 mm
  • Low-Bias
    YES
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    YES
  • Technology
    CMOS
  • Architecture
    VOLTAGE-FEEDBACK
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    TSSOP
  • Sub Category
    Operational Amplifier
  • JESD-609 Code
    e4
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Slew Rate-Nom
    3 V/us
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Packing Method
    TR
  • Power Supplies
    2.7/5 V
  • Terminal Pitch
    0.65 mm
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Seated Height-Max
    1.1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Unity Gain BW-Nom
    4000 kHz
  • Programmable Power
    NO
  • Supply Current-Max
    0.6 mA
  • Number of Functions
    1
  • Number of Terminals
    5
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Input Offset Voltage-Max
    6000 uV
  • Package Equivalence Code
    TSOP5/6,.11,37
  • Supply Voltage Limit-Max
    6 V
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    2.7 V
  • Moisture Sensitivity Level
    1
  • Common-mode Reject Ratio-Min
    50 dB
  • Common-mode Reject Ratio-Nom
    65 dB
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
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