DS2502P-E64+ by Analog Devices, Inc. | Sourcengine

Analog Devices, Inc. DS2502P-E64+

Lifecycle status
NRFND
RoHS
RoHS compliant
REACH
REACH compliant
Description
IEEE EUI-64 Node Address Chip
Category
Semiconductors Memory ICs OTP ROMs OTP ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

I/O Type
COMMON
Technology
MOS
Width (mm)
3.76
Length (mm)
3.94
JESD-30 Code
R-PDSO-C6
Memory Width
1
Package Code
LSOC
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
C BEND
Memory IC Type
OTP ROM
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
Matte Tin (Sn) - annealed
DLA Qualification
Not Qualified
Terminal Position
DUAL
Memory Organization
1KX1
Number of Functions
1
Number of Terminals
6
Terminal Pitch (mm)
1.27
Number of Words Code
1K
Memory Density (bits)
1024
Package Body Material
PLASTIC/EPOXY
Output Characteristics
OPEN-DRAIN
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
6
Supply Voltage-Min (V)
2.8
Number of Words (words)
1024
Programming Voltage (V)
11.75
Package Equivalence Code
SOC6,.17
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30