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DPE1124A-250I

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPE1124A-250I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Page Size
    256 words
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDIP-T56
  • Memory Width
    16
  • Organization
    64KX16
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1048576 bit
  • Memory IC Type
    EEPROM MODULE
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    250 ns
  • Number of Words
    65536 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    660 mA
  • Number of Terminals
    56
  • Standby Current-Max
    0.48 Amp
  • Number of Words Code
    64K
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP56,1.5
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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DPE1124A-250I
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DPE1124A-250I