VIA TECHNOLOGIES INC CX87SLC-25QP
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-G80
  • Package Code
    QFP
  • Boundary Scan
    NO
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    0.635 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Address Bus Width
    0
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Supply Current-Max
    320 mA
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    4.5 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    25 MHz
  • Number of Terminals
    80
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    0
  • Package Equivalence Code
    QFP80,.7SQ
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • uPs/uCs/Peripheral ICs Type
    MATH PROCESSOR, COPROCESSOR

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CX87SLC-25QP
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CX87SLC-25QP