Texas Instruments Incorporated CC1111F32RSPR
  • ECCN
    5A992.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    6
  • JESD-30 Code
    S-PQCC-N36
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e4
  • Terminal Finish
    NICKEL PALLADIUM GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    QUAD
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    .5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    .9
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for CC1111F32RSPR

Send an RFQ

Negotiated savings, bought with a click.

Send an RFQ
CC1111F32RSPR
Send an RFQ
CC1111F32RSPR