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AM93L425PC

Advanced Micro Devices, Inc. (AMD)

AM93L425PC Datasheet
Advanced Micro Devices, Inc. (AMD) AM93L425PC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    7.62
  • Length
    19.05
  • Technology
    TTL
  • JESD-30 Code
    R-PDIP-T16
  • Memory Width
    1
  • Organization
    1KX1
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Output Enable
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1024
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54
  • Access Time-Max
    60
  • Number of Ports
    1
  • Number of Words
    1024
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    5.08
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Supply Current-Max
    65
  • Number of Functions
    1
  • Number of Terminals
    16
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max
    75
  • Operating Temperature-Min
    0
  • Supply Voltage-Max (Vsup)
    5.25
  • Supply Voltage-Min (Vsup)
    4.75
  • Supply Voltage-Nom (Vsup)
    5

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AM93L425PC