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AM29SL800BT170FI

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM29SL800BT170FI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    TOP
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Data Polling
    YES
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Reverse Pinout
    YES
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    USER CONFIGURABLE AS 512K X 16
  • Memory Organization
    1MX8
  • Number of Functions
    1
  • Number of Terminals
    48
  • Sector Size (words)
    16K,8K,32K,64K
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    170
  • Number of Words Code
    1M
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Command User Interface
    YES
  • Number of Sectors/Size
    1,2,1,15
  • Supply Voltage-Max (V)
    2.2
  • Supply Voltage-Min (V)
    1.8
  • Supply Voltage-Nom (V)
    2
  • Number of Words (words)
    1048576
  • Programming Voltage (V)
    1.8
  • Standby Current-Max (A)
    5.0E-6
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    TSSOP56,.8,20
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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AM29SL800BT170FI
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AM29SL800BT170FI