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AM28F256-75C3DCB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM28F256-75C3DCB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Width (mm)
    15.24
  • Length (mm)
    42.1005
  • Data Polling
    NO
  • JESD-30 Code
    R-GDIP-T32
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32KX8
  • Number of Functions
    1
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    70
  • Number of Words Code
    32K
  • Memory Density (bits)
    262144
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Command User Interface
    YES
  • Seated Height-Max (mm)
    5.588
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    30
  • Package Equivalence Code
    DIP32,.6
  • Endurance (Write/Erase Cycles)
    1000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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AM28F256-75C3DCB
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AM28F256-75C3DCB