Compliance Details

  • SB Code
    8542.39.00.00
  • HTS Code
    8542.39.00.01
  • ECCN Governance
    EAR
  • ECCN
    EAR99
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Additional Information

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Technical Details

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  • Width
    4 mm
  • Length
    4 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B16
  • Package Code
    TFLGA
  • JESD-609 Code
    e4
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BUTT
  • Terminal Pitch
    0.65 mm
  • Terminal Finish
    Nickel/Gold (Ni/Au) - electrolytic
  • Seated Height-Max
    1.1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    16
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Package Equivalence Code
    LCC16,.16SQ,25
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.4 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
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