935361285557
NXP Semiconductors NV
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionCMOS, PBGA780
- Category
- HTS Code8542.31.00.01
- SB Code8542.31.00.00
- Width23 mm
- Length23 mm
- TechnologyCMOS
- JESD-30 CodeS-PBGA-B780
- Package CodeFBGA
- JESD-609 Codee1
- Package ShapeSQUARE
- Package StyleGRID ARRAY, FINE PITCH Meter
- Surface MountYES
- Terminal FormBALL
- Terminal Pitch0.8 mm
- Terminal FinishTIN SILVER COPPER
- Seated Height-Max2.61 mm
- Terminal PositionBOTTOM
- Supply Voltage-Max1.055 V
- Supply Voltage-Min0.995 V
- Supply Voltage-Nom1.025 V
- Number of Terminals780
- Package Body MaterialPLASTIC/EPOXY
- Package Equivalence CodeBGA780,28X28,32
- Operating Temperature-Max105 Cel
- Operating Temperature-Min-40 Cel
- Moisture Sensitivity Level3
- uPs/uCs/Peripheral ICs TypeSYSTEM ON CHIP
- Peak Reflow Temperature (Cel)250
- Time@Peak Reflow Temperature-Max (s)30
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