Renesas Electronics Corp. 71V65703S75BG
  • Lifecycle status
    Active
  • RoHS
    RoHS compliant
  • Description
    3.3V 256K x 36 ZBT Synchronous 3.3V I/O Flowthrough SRAM PBGA 14.00x22.00x2.15 mm 1.27mm Pitch
  • Category
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    22
  • Length
    14
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B119
  • Memory Width
    36
  • Organization
    256KX36
  • Package Code
    BGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    9437184
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27
  • Access Time-Max
    7.5
  • Number of Words
    262144
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    2.36
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH ARCHITECTURE
  • Supply Current-Max
    275
  • Number of Functions
    1
  • Number of Terminals
    119
  • Standby Current-Max
    .04
  • Standby Voltage-Min
    3.14
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA119,7X17,50
  • Operating Temperature-Max
    70
  • Operating Temperature-Min
    0
  • Supply Voltage-Max (Vsup)
    3.465
  • Supply Voltage-Min (Vsup)
    3.135
  • Supply Voltage-Nom (Vsup)
    3.3
  • Clock Frequency-Max (fCLK)
    100
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    20

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71V65703S75BG