Renesas Electronics Corp. 71V3556S166PFGI
  • Lifecycle status
    EOL
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 3.3V I/O TQFP 20.00x14.00x1.40 mm 0.65mm Pitch
  • Category
  • ECCN
    3A991.B.2.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14
  • Length
    20
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    36
  • Organization
    128KX36
  • Package Code
    LQFP
  • JESD-609 Code
    e3
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    4718592
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    .65
  • Access Time-Max
    3.5
  • Number of Words
    131072
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    MATTE TIN
  • Seated Height-Max
    1.6
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    360
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    .045
  • Standby Voltage-Min
    3.14
  • Number of Words Code
    128K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Max
    85
  • Operating Temperature-Min
    -40
  • Supply Voltage-Max (Vsup)
    3.465
  • Supply Voltage-Min (Vsup)
    3.135
  • Supply Voltage-Nom (Vsup)
    3.3
  • Clock Frequency-Max (fCLK)
    166
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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