71V3556S166PFGI by Renesas Electronics Corp. | Sourcengine

Lifecycle status

Active
RoHS

RoHS compliant
Description

TQFP 20.00x14.00x1.40 mm 0.65mm Pitch
Category

Semiconductors Memory Ics Srams Zbt Sram

SB Code

8542.32.00.40
HTS Code

8542.32.00.41
ECCN Governance

EAR
ECCN

3A991.B.2.A

Width

14 mm
Length

20 mm
I/O Type

COMMON
Technology

CMOS
JESD-30 Code

R-PQFP-G100
Memory Width

36
Organization

128KX36
Package Code

LQFP
Sub Category

SRAMs
JESD-609 Code

e3
Package Shape

RECTANGULAR
Package Style

FLATPACK, LOW PROFILE Meter
Surface Mount

YES
Terminal Form

GULL WING
Memory Density

4718592 bit
Memory IC Type

ZBT SRAM
Operating Mode

SYNCHRONOUS
Power Supplies

3.3 V
Terminal Pitch

0.65 mm
Access Time-Max

3.5 ns
Number of Words

131072 words
Parallel/Serial

PARALLEL
Terminal Finish

MATTE TIN
Seated Height-Max

1.6 mm
Temperature Grade

INDUSTRIAL
Terminal Position

QUAD
Supply Current-Max

0.36 mA
Number of Functions

1
Number of Terminals

100
Standby Current-Max

0.045 Amp
Standby Voltage-Min

3.14 V
Number of Words Code

128K
Qualification Status

Not Qualified
Package Body Material

PLASTIC/EPOXY
Output Characteristics

3-STATE
Package Equivalence Code

QFP100,.63X.87
Operating Temperature-Max

85 Cel
Operating Temperature-Min

-40 Cel
Supply Voltage-Max (Vsup)

3.465 V
Supply Voltage-Min (Vsup)

3.135 V
Supply Voltage-Nom (Vsup)

3.3 V
Clock Frequency-Max (fCLK)

166 MHz
Moisture Sensitivity Level

3
Peak Reflow Temperature (Cel)

260
Time@Peak Reflow Temperature-Max (s)

30