Compliance Details

  • SB Code
    8542.32.00.40
  • HTS Code
    8542.32.00.41
  • ECCN Governance
    EAR
  • ECCN
    EAR99
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Packaging type
Packaging condition
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Additional Information

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Technical Details

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  • Width
    10 mm
  • Length
    10 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PQFP-F64
  • Memory Width
    8
  • Organization
    1KX8
  • Package Code
    QFF
  • Sub Category
    SRAMs
  • JESD-609 Code
    e3
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    8192 bit
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Power Supplies
    3.3 V
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    55 ns
  • Number of Ports
    2
  • Number of Words
    1024 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    0.135 mA
  • Number of Functions
    1
  • Number of Terminals
    64
  • Standby Current-Max
    0.005 Amp
  • Standby Voltage-Min
    3 V
  • Number of Words Code
    1K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    QFP64,.47SQ,20
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
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