66AK2H12DAAW2
Texas Instruments Incorporated
- Lifecycle statusActive
- RoHSRoHS compliant
- REACHREACH compliant
- DescriptionHigh performance multicore DSP+Arm - 4x Arm A15 cores, 8x C66x DSP cores 1517-FCBGA 0 to 85
- Category
- ECCN5A991.B
- ECCN GovernanceEAR
- HTS Code8542.31.00.01
- SB Code8542.31.00.00
- TechnologyCMOS
- Width (mm)40
- Length (mm)40
- JESD-30 CodeS-PBGA-B1517
- Package CodeBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee1
- Terminal FinishTIN SILVER COPPER
- Temperature GradeOTHER
- Terminal PositionBOTTOM
- Number of Terminals1517
- Terminal Pitch (mm)1
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)3.62
- Supply Voltage-Max (V)1.05
- Supply Voltage-Min (V)0.95
- Supply Voltage-Nom (V)1
- Moisture Sensitivity Level4
- uPs/uCs/Peripheral ICs TypeSoC
- Peak Reflow Temperature (Cel)245
- Operating Temperature-Max (Cel)85
- Operating Temperature-Min (Cel)0
- Time@Peak Reflow Temperature-Max (s)30
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66AK2H12DAAW2