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5962H9689104QYA

AEROFLEX MICROELECTRONIC SOLUTIONS

AEROFLEX MICROELECTRONIC SOLUTIONS 5962H9689104QYA
  • ECCN
    3A001.a.1.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Total Dose
    1M Rad(Si) V
  • JESD-30 Code
    R-XDIP-T28
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb) - hot dipped
  • DLA Qualification
    Not Qualified
  • Terminal Position
    DUAL
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    100
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    32768
  • Standby Current-Max (A)
    0.002
  • Supply Current-Max (mA)
    125
  • Package Equivalence Code
    DIP28,.6
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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5962H9689104QYA