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5962-9951401NXB

Xilinx,Inc.

Xilinx,Inc. 5962-9951401NXB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    7.5
  • Length (mm)
    12.8
  • JESD-30 Code
    R-PDSO-G20
  • Memory Width
    1
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    1MX1
  • Number of Functions
    1
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    1M
  • Memory Density (bits)
    1048576
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.65
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    SOP20,.4
  • Clock Frequency-Max (MHz)
    15
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535 Class N

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5962-9951401NXB
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5962-9951401NXB