5962-9309103HYC

Microsemi Corporation

Microsemi Corporation 5962-9309103HYC
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-CDIP-T32
  • Memory Width
    8
  • Organization
    512KX8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    4194304 bit
  • Memory IC Type
    EEPROM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Access Time-Max
    250 ns
  • Number of Words
    524288 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    5.13 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    AUTOMATIC WRITE
  • Number of Functions
    1
  • Number of Terminals
    32
  • Programming Voltage
    5 V
  • Number of Words Code
    512K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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5962-9309103HYC
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5962-9309103HYC