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5962-9201201MLA

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS 5962-9201201MLA
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • Technology
    TTL
  • Architecture
    PLS-TYPE
  • JESD-30 Code
    R-XDIP-T24
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb) - hot dipped
  • Number of Inputs
    12
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    8
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Product Terms
    48
  • Programmable Logic Type
    OT PLD
  • Package Equivalence Code
    DIP24,.3
  • Clock Frequency-Max (MHz)
    10.5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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5962-9201201MLA
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5962-9201201MLA