Microchip Technology Inc. 5962-8984115LA
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    7.62 mm
  • Length
    32.005 mm
  • Technology
    CMOS
  • Architecture
    PAL-TYPE
  • JESD-30 Code
    R-CDIP-T24
  • Organization
    10 DEDICATED INPUTS, 10 I/O
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Terminal Pitch
    2.54 mm
  • Output Function
    MACROCELL
  • Screening Level
    MIL-STD-883
  • Number of Inputs
    22
  • Number of Outputs
    10
  • Propagation Delay
    15 ns
  • Seated Height-Max
    5.08 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    4.5 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    55.5 MHz
  • Number of I/O Lines
    10
  • Number of Terminals
    24
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Programmable Logic Type
    FLASH PLD
  • Package Equivalence Code
    DIP24,.3
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Number of Dedicated Inputs
    10

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5962-8984115LA
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5962-8984115LA