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3DFN32G08VS8633-IB-A25

3D PLUS SA

3D PLUS SA 3DFN32G08VS8633-IB-A25
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Page Size
    2K words
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Sector Size
    128K Words
  • Data Polling
    NO
  • Memory Width
    8
  • Organization
    4GX8
  • Surface Mount
    YES
  • Memory Density
    34359738368 bit
  • Memory IC Type
    FLASH MODULE
  • Access Time-Max
    25 ns
  • Number of Words
    4294967296 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Supply Current-Max
    37 mA
  • Number of Terminals
    50
  • Standby Current-Max
    0.0004 Amp
  • Number of Words Code
    4G
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    32K
  • Package Equivalence Code
    SSOP50,.8,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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3DFN32G08VS8633-IB-A25