3D3D16G16YB4751CN by 3D PLUS SA | Sourcengine

3D PLUS SA 3D3D16G16YB4751CN

Lifecycle status
Contact Mfr
Description
DDR3 DRAM, 1GX16, CMOS, PBGA95
Category
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
14
Access Mode
DUAL BANK PAGE BURST
Length (mm)
20
JESD-30 Code
R-PBGA-B95
Memory Width
16
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH, IT ALSO REQUIRES 1.5V SUPPLY
Memory Organization
1GX16
Number of Functions
1
Number of Terminals
95
Terminal Pitch (mm)
1.27
Number of Words Code
1G
Memory Density (bits)
17179869184
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
8.8
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.283
Supply Voltage-Nom (V)
1.35
Number of Words (words)
1073741824
Sequential Burst Length
4,8
Standby Current-Max (A)
0.104
Supply Current-Max (mA)
460
Interleaved Burst Length
4,8
Package Equivalence Code
BGA95,8X12,50
Clock Frequency-Max (MHz)
667
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0