Microchip Technology Inc. 25LC256-M/MF
  • Lifecycle status
    Active
  • RoHS
    RoHS compliant
  • REACH
    REACH compliant
  • Description
    256k, 32K X 8 , 2.5V SER EE MIL TEMP
  • Category
  • ECCN
    3A001.A.2.C
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    5
  • Length
    6
  • Endurance
    1000000
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-N8
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    HVSON
  • JESD-609 Code
    e3
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Memory Density
    262144
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27
  • Number of Ports
    1
  • Number of Words
    32768
  • Parallel/Serial
    SERIAL
  • Screening Level
    TS 16949
  • Serial Bus Type
    SPI
  • Terminal Finish
    MATTE TIN
  • Write Protection
    HARDWARE
  • Seated Height-Max
    1
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    2.5V TO 4.5V @ 5MHz
  • Supply Current-Max
    6
  • Number of Functions
    1
  • Number of Terminals
    8
  • Programming Voltage
    5
  • Standby Current-Max
    .000005
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    200
  • Package Equivalence Code
    SOLCC8,.25
  • Operating Temperature-Max
    125
  • Operating Temperature-Min
    -55
  • Supply Voltage-Max (Vsup)
    5.5
  • Supply Voltage-Min (Vsup)
    4.5
  • Supply Voltage-Nom (Vsup)
    5
  • Clock Frequency-Max (fCLK)
    10
  • Moisture Sensitivity Level
    1
  • Write Cycle Time-Max (tWC)
    5
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40

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25LC256-M/MF