Technical Details

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Width 8 mm
Length 12.5 mm
I/O Type COMMON
Technology CMOS
Access Mode FOUR BANK PAGE BURST
JESD-30 Code R-PBGA-B84
Memory Width 16
Organization 8MX16
Package Code TFBGA
Self Refresh YES
Sub Category DRAMs
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount YES
Terminal Form BALL
Memory Density 134217728 bit
Memory IC Type DDR DRAM
Operating Mode SYNCHRONOUS
Power Supplies 1.8 V
Refresh Cycles 4096
Terminal Pitch 0.8 mm
Access Time-Max 0.4 ns
Number of Ports 1
Number of Words 8388608 words
Seated Height-Max 1.2 mm
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature AUTO/SELF REFRESH
Supply Current-Max 0.135 mA
Number of Functions 1
Number of Terminals 84
Standby Current-Max 0.008 Amp
Number of Words Code 8M
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Package Equivalence Code BGA84,9X15,32
Operating Temperature-Max 95 Cel
Operating Temperature-Min -40 Cel
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Clock Frequency-Max (fCLK) 400 MHz
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compliance Details

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ECCN EAR99
ECCN Governance EAR
HTS Code 8542.32.00.02
SB Code 8542.32.00.15