Technical Details

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Type SLC NAND TYPE
Width 9 mm
Length 11 mm
Technology CMOS
JESD-30 Code R-PBGA-B63
Memory Width 8
Organization 2GX8
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount YES
Terminal Form BALL
Memory Density 17179869184 bit
Memory IC Type FLASH
Operating Mode ASYNCHRONOUS
Terminal Pitch 0.8 mm
Number of Words 2147483648 words
Parallel/Serial PARALLEL
Seated Height-Max 1.2 mm
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Number of Functions 1
Number of Terminals 63
Programming Voltage 1.8 V
Number of Words Code 2G
Package Body Material PLASTIC/EPOXY
Alternate Memory Width 4
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compliance Details

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ECCN EAR99
ECCN Governance EAR
HTS Code 8542.32.00.51
SB Code 8542.32.00.50