Request Quote

SK HYNIX INC. H26M64208EMR
Quantity
Target Price

1 traceable supplier for H26M64208EMR available

1 traceable supplier available

  • Includes:
  • Scheduled shipping up to a year
  • 3 year warranty
Supply Attributes Supplier Availability Price Quantity Total
Supply Attributes
  • Date Code Within 2 years
  • Pack Type Tape & reel
  • Pack Condition Unknown
Supplier Availability
  • Stock 0
  • Lead time qty. 1,150
  • Lead Time: 200 ~ 201 weeks
Price
  • 800+ $ 20.18287
Quantity
MPQ 1
Min
Total $ 0.00

Technical Details

back to top
Width 11.5 mm
Length 13 mm
Technology CMOS
JESD-30 Code R-PBGA-B153
Memory Width 8
Organization 32GX8
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount YES
Terminal Form BALL
Memory Density 274877906944 bit
Memory IC Type FLASH
Operating Mode SYNCHRONOUS
Terminal Pitch 0.5 mm
Number of Words 34359738368 words
Parallel/Serial PARALLEL
Seated Height-Max 1 mm
Temperature Grade OTHER
Terminal Position BOTTOM
Number of Functions 1
Number of Terminals 153
Programming Voltage 3.3 V
Number of Words Code 32G
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 Cel
Operating Temperature-Min -25 Cel
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compliance Details

back to top
ECCN EAR99
ECCN Governance EAR
HTS Code 8542.32.00.51
SB Code 8542.32.00.50