1 traceable supplier for MX69V28F64MBXLW available

1 traceable supplier available

  • Includes:
  • Scheduled shipping up to a year
  • 3 year warranty
No live offers were found.
Supply Attributes Supplier Availability Price Quantity Total
Supply Attributes
  • Date Code Within 2 years
  • Pack Type Tape & reel
  • Pack Condition Unknown
Supplier Availability
  • Stock 0
  • Lead time qty. 6,071
  • Lead Time: 17 ~ 18 weeks
Price
  • 2,500+ $ 3.65678
  • 5,000+ $ 3.60528
Quantity
MPQ 1
Min
Total $ 0.00

Technical Details

back to top
Width 6.2 mm
Length 7.7 mm
Technology CMOS
JESD-30 Code R-PBGA-B56
Memory Width 16
Organization 8MX16
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount YES
Terminal Form BALL
Memory Density 134217728 bit
Memory IC Type MEMORY CIRCUIT
Operating Mode SYNCHRONOUS
Terminal Pitch 0.5 mm
Number of Words 8388608 words
Seated Height-Max 1.05 mm
Temperature Grade OTHER
Terminal Position BOTTOM
Additional Feature IT IS ALSO HAVING 64MBIT PSRAM
Number of Functions 1
Number of Terminals 56
Number of Words Code 8M
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 Cel
Operating Temperature-Min -25 Cel
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compliance Details

back to top
ECCN EAR99
ECCN Governance EAR
HTS Code 8542.32.00.71
SB Code 8542.32.00.70