1 traceable supplier for TC58NYG1S3HBAI4 available

1 traceable supplier available

  • Includes:
  • Scheduled shipping up to a year
  • 3 year warranty
Supply Attributes Supplier Availability Price Quantity Total
Supply Attributes
  • Date Code Within 2 years
  • Pack Type Tape & reel
  • Pack Condition Unknown
Supplier Availability
  • Stock 0
  • Lead time qty. 7,758
  • Lead Time: 18 ~ 19 weeks
Price
  • 210+ $ 2.91329
  • 420+ $ 2.85269
  • 840+ $ 2.77811
  • 1,260+ $ 2.64759
  • 1,680+ $ 2.57301
Quantity
MPQ 1
Min
Total $ 0.00

Technical Details

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Type SLC NAND TYPE
Width 9 mm
Length 11 mm
Technology CMOS
JESD-30 Code R-PBGA-B63
Memory Width 8
Organization 256MX8
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount YES
Terminal Form BALL
Memory Density 2147483648 bit
Memory IC Type FLASH
Operating Mode ASYNCHRONOUS
Terminal Pitch 0.8 mm
Number of Words 268435456 words
Parallel/Serial PARALLEL
Seated Height-Max 1 mm
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Number of Functions 1
Number of Terminals 63
Programming Voltage 1.8 V
Number of Words Code 256M
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V

Compliance Details

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ECCN EAR99
ECCN Governance EAR
HTS Code 8542.32.00.51
SB Code 8542.32.00.50