1 traceable supplier for GS88218CGD-300I available

1 traceable supplier available

  • Includes:
  • Scheduled shipping up to a year
  • 3 year warranty
Supply Attributes Supplier Availability Price Quantity Total
Supply Attributes
  • Date Code Within 2 years
  • Pack Type Tape & reel
  • Pack Condition Unknown
Supplier Availability
  • Stock 0
  • Lead time qty. 927
  • Lead Time: 12 ~ 13 weeks
Price
  • 36+ $ 24.81878
  • 72+ $ 24.25465
  • 144+ $ 23.04945
  • 216+ $ 22.44685
  • 288+ $ 21.39230
Quantity
MPQ 1
Min
Total $ 0.00

Technical Details

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Width 13 mm
Length 15 mm
Technology CMOS
JESD-30 Code R-PBGA-B165
Memory Width 18
Organization 512KX18
Package Code LBGA
JESD-609 Code e1
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE Meter
Surface Mount YES
Terminal Form BALL
Memory Density 9437184 bit
Memory IC Type CACHE SRAM
Operating Mode SYNCHRONOUS
Terminal Pitch 1 mm
Access Time-Max 5 ns
Number of Words 524288 words
Parallel/Serial PARALLEL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Seated Height-Max 1.4 mm
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY
Number of Functions 1
Number of Terminals 165
Number of Words Code 512K
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 Cel
Operating Temperature-Min -40 Cel
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compliance Details

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ECCN 3A991.B.2.A
ECCN Governance EAR
HTS Code 8542.32.00.41
SB Code 8542.32.00.40