1 traceable supplier for GS8342TT19BGD-350 available

1 traceable supplier available

  • Includes:
  • Scheduled shipping up to a year
  • 3 year warranty
Supply Attributes Supplier Availability Price Quantity Total
Supply Attributes
  • Date Code Within 2 years
  • Pack Type Tape & reel
  • Pack Condition Unknown
Supplier Availability
  • Stock 0
  • Lead time qty. 466
  • Lead Time: 15 weeks
Price
  • 15+ $ 49.44810
  • 30+ $ 48.32415
  • 60+ $ 45.92295
  • 90+ $ 44.72235
  • 120+ $ 42.62130
Quantity
MPQ 1
Min
Total $ 0.00

Technical Details

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Width 13 mm
Length 15 mm
I/O Type COMMON
Technology CMOS
JESD-30 Code R-PBGA-B165
Memory Width 18
Organization 2MX18
Package Code LBGA
Sub Category SRAMs
JESD-609 Code e1
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE Meter
Surface Mount YES
Terminal Form BALL
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Operating Mode SYNCHRONOUS
Power Supplies 1.5/1.8,1.8 V
Terminal Pitch 1 mm
Access Time-Max 0.45 ns
Number of Words 2097152 words
Parallel/Serial PARALLEL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Seated Height-Max 1.4 mm
Temperature Grade COMMERCIAL
Terminal Position BOTTOM
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
Number of Functions 1
Number of Terminals 165
Standby Voltage-Min 1.7 V
Number of Words Code 2M
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Operating Temperature-Max 70 Cel
Operating Temperature-Min 0 Cel
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Clock Frequency-Max (fCLK) 350 MHz
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compliance Details

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ECCN 3A991.B.2.A
ECCN Governance EAR
HTS Code 8542.32.00.41
SB Code 8542.32.00.40